In PCBA patch assembly: SMT and DIP. SMT (Surface Mount Technology) is a surface mount technology. By pasting electronic components directly on the surface of the PCB, the component pins do not need to penetrate the circuit board to complete the assembly. This assembly method is suitable for small, lightweight, and highly integrated of electronic products. The advantages of surface mount assembly are saving space, improving production efficiency, reducing costs, and improving product reliability, but the quality requirements for electronic components are higher, and it is not easy to repair and replace. DIP ( dual in-line package ) is a plug-in technology, which needs to insert electronic components into the PCB surface through holes, and then solder and fix them. This assembly method is suitable for large-scale, high-power, high-reliability electronic products. The advantage of plug-in assembly is that the structure of the plug-in itself is relatively stable and easy to repair and replace. However, plug-in assembly requires a large space and is not suitable for small products. In addition to these two types, there is another assembly method called a hybrid assembly, which is to use both SMT and DIP technologies for assembly to meet the assembly requirements of different components. Hybrid assembly can take into account the advantages of SMT and DIP, and can also effectively solve some problems in assembly, such as complicated PCB layouts. In actual production, the hybrid assembly has been widely used.