Difference between HDI board and normal pcb


High Density Interconnector (HDI) is a high density circuit board that uses micro-blind buried vias. HDI boards have an inner layer of circuits and an outer layer of circuits, which are then connected internally by drilling holes, in-hole metallization, and other processes.

HDI boards are generally manufactured using the layer-building method, and the more layers are built up, the higher the technical grade of the board. Ordinary HDI board is basically 1 time layer, high-level HDI using 2 or more times the layer technology, while using stacked holes, plating to fill the holes, laser direct hole punching and other advanced PCB technology. When the density of the PCB increases more than eight layers of the board, to HDI to manufacture, its cost will be lower than the traditional complex compression process.

The electrical performance and signal correctness of HDI boards are higher than that of traditional PCBs. In addition, HDI boards have better improvements for RF interference, electromagnetic wave interference, electrostatic discharge, and thermal conduction. High Density Integration (HDI) technology allows end product designs to be miniaturized while meeting higher standards of electronic performance and efficiency.

HDI board using blind hole plating and then the second pressing, divided into first-order, second-order, third-order, fourth-order, fifth-order, etc., first-order is relatively simple, process and technology are good control.

The main problems of the second order, one is the problem of alignment, the second is the problem of punching and copper plating.

Second-order design has a variety of, one is the staggered position of each order, the need to connect the next neighboring layer through the wire in the middle of the layer connected, the practice is equivalent to two first-order HDI.

The second is that the two first-order holes overlap, through the superimposed way to realize the second order, the processing is similar to the two first-order, but there are many process points to be specially controlled, that is, the above mentioned.

The third is directly from the outer layer of holes to the third layer (or N-2 layer), the process is much different from the previous, the difficulty of punching holes is also greater. For the third order to the second order analog that is.

Printed circuit board, an important electronic component, is the support body of electronic components, is the carrier of the electrical connection of electronic components. Ordinary PCB board is FR-4-based, its epoxy resin and electronic glass cloth pressed together.

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