Production of automotive electronic grade multi-layer circuit boards

With the rapid development of the automotive industry, especially the rise of new energy vehicles and intelligent driving technology, the degree of automotive electronics has continued to increase, and higher requirements have been placed on the performance and reliability of electronic components. In this context, the production of automotive electronic-grade multi-layer circuit boards has become a core link in automotive electronic systems. The following will explore in depth the key technologies and production processes for the production of automotive electronic-grade multi-layer circuit boards, as well as their importance in modern automobile manufacturing.

The Importance of Automotive Electronic-Grade Multi-Layer Circuit Boards

Automotive electronic-grade multi-layer circuit boards are indispensable basic components in automotive electronic systems. They provide stable electrical connections and signal transmission for various electronic devices. Compared with traditional single-layer or double-layer circuit boards, multi-layer circuit boards have been widely used in the field of automotive electronics due to their high density, high performance and high reliability.

Key technologies for multi-layer circuit board production

Fine circuit production: Advanced photolithography and etching technology are used to achieve high-precision circuit production to meet the needs of automotive electronic products for fine circuits.

Multi-layer lamination technology: Through precise lamination technology, circuit boards at different levels are tightly combined to ensure the structural stability of multi-layer circuit boards.

High reliability design: The operating requirements of automotive electronic products in harsh environments are taken into account during the design stage, and high-reliability materials and design methods are adopted.

Thermal management: In view of the heat dissipation problem of automotive electronic equipment, effective thermal management technologies such as embedded copper blocks or heat pipes are adopted to improve the heat dissipation performance of circuit boards.

Electromagnetic compatibility: Considering the problem of electromagnetic interference in automotive electronic systems, multi-layer circuit boards must meet electromagnetic compatibility standards during the design and production process.

Production process overview

Material preparation: Select appropriate substrate materials and conductive materials to meet the special requirements of automotive electronic products.

Inner layer production: Make the required circuit pattern on the inner layer board, and form the inner layer circuit through etching process.

Lamination process: Laminate the inner layer with prepreg materials (such as FR-4) to form a multi-layer structure.

Drilling and hole metallization: Drill through holes and metallize the hole walls by electroplating or chemical copper plating.

Outer layer production: Make circuit patterns on the outer copper foil and form outer layer circuits by etching.

Surface treatment: According to the requirements of subsequent welding processes, surface treatments such as hot air leveling (HASL) and chemical nickel-gold plating (ENIG) are performed.

Quality inspection: Strict quality inspection of the completed multilayer circuit boards, including size, conductivity and reliability tests.

The production of automotive-grade multilayer circuit boards is an important support for the development of the automotive electronics industry. With the continuous advancement of technology and the continuous expansion of market demand, the production of automotive-grade multilayer circuit boards will continue to develop in the direction of higher density, higher reliability and higher performance. By adopting advanced production technology and strict quality control, automotive-grade multilayer circuit boards will provide a solid foundation for the innovation and development of automotive electronic systems.