Analysis of the complete process of PCB board manufacturing

2024-11-09

1. Prototyping


Schematic and Layout

Prototype Definition: At this stage, engineers define the preliminary specifications of the PCB based on the functional requirements, performance indicators, and physical dimensions of the product. This includes determining the number of layers required, the type and quantity of components, and the expected working environment.


Layout Planning: Engineers will use professional PCB design software to plan the layout of electronic components. This not only takes into account signal flow and electromagnetic compatibility, but also thermal management, power distribution, and mechanical structure compatibility.


Layout Verification

Rule Checking: Use automated tools to check whether the design complies with specific design rules, which include trace width, spacing, component spacing, etc., to ensure that the design meets manufacturing and electrical specifications.


Signal and Thermal Analysis: Signal integrity analysis is performed through simulation software to evaluate the transmission quality of high-speed signals on the PCB. At the same time, thermal analysis is performed to ensure that the PCB can maintain stable operation under high load.



2. Manufacturing Preparation


Material Selection

Substrate Material: When selecting a substrate material, its electrical properties, mechanical strength, thermal properties, and cost need to be considered. For example, FR-4 is a common substrate material, while PTFE is used in high-performance applications due to its excellent high-frequency performance.


Copper foil: The thickness of the copper foil affects the current carrying capacity and signal transmission quality of the circuit. Engineers will choose the appropriate copper foil thickness based on the current demand and signal characteristics.


Manufacturing file generation

Photolithography file: Converting the design to a photolithography file is a critical step because it directly affects the quality and accuracy of the subsequent.


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